![](/images/ico/ico_close.png)
![](/images/ico/ico5.png)
Author: Katkov A V Chi Jim Wang C C Cheng C
Publisher: IOP Publishing
ISSN: 0268-1242
Source: Semiconductor Science and Technology, Vol.26, Iss.2, 2011-02, pp. : 22001-22004
Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.
Abstract
Related content
![](/images/ico/ico_close.png)
![](/images/ico/ico5.png)
![](/images/ico/ico_close.png)
![](/images/ico/ico5.png)
By Kang Sangbeom Doolittle W. Alan Lee K. K. Dai Z.R. Wang Z.L. Stock Stuart R. Brown April S.
Journal of Electronic Materials, Vol. 30, Iss. 3, 2001-03 ,pp. :
![](/images/ico/ico_close.png)
![](/images/ico/ico5.png)
By Kaun Stephen W Ahmadi Elaheh Mazumder Baishakhi Wu Feng Kyle Erin C H Burke Peter G Mishra Umesh K Speck James S
Semiconductor Science and Technology, Vol. 29, Iss. 4, 2014-04 ,pp. :
![](/images/ico/ico_close.png)
![](/images/ico/ico5.png)
By Nötzel Richard Ramsteiner Manfred Niu Zhichuan Trampert Achim Däweritz Lutz Ploog Klaus
Journal of Electronic Materials, Vol. 27, Iss. 1, 1998-12 ,pp. :
![](/images/ico/ico_close.png)
![](/images/ico/ico5.png)
By Ivanov S V Nechaev D V Sitnikova A A Ratnikov V V Yagovkina M A Rzheutskii N V Lutsenko E V Jmerik V N
Semiconductor Science and Technology, Vol. 29, Iss. 8, 2014-06 ,pp. :