The influence of a grain boundary on the thermal transport properties of bulk, melt-processed Y–Ba–Cu–O

Author: Marchal C   Fagnard J F   Shi Y H   Cardwell D A   Mucha J   Misiorek H   Cloots R   Vertruyen B   Vanderbemden P  

Publisher: IOP Publishing

ISSN: 0953-2048

Source: Superconductor Science and Technology, Vol.26, Iss.1, 2013-01, pp. : 15006-15013

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