The effect of thiourea, l(−) cysteine and glycine additives on the mechanisms and kinetics of copper electrodeposition

Author： Tadesse Bogale   Horne Michael   Addai-Mensah Jonas  

Publisher： Springer Publishing Company

ISSN： 0021-891X

Source： Journal of Applied Electrochemistry, Vol.43, Iss.12, 2013-12, pp. : 1185-1195

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