The influence of intermediate particles on the nucleation of copper on polycrystalline platinum

By Danilov A.I.   Andersen J.E.T.   Molodkina E.B.   Polukarov Y.M.   M   ller P.   Ulstrup J.  

Electrochimica Acta, Vol. 43, Iss. 7, 1998-01 ,pp. : 733-741

Elsevier

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Influence of organic adsorbates on the under and overpotential deposition of copper on polycrystalline platinum electrodes

By Alonso C.   Pascual M.J.   Abruna H.D.  

Electrochimica Acta, Vol. 42, Iss. 11, 1997-01 ,pp. : 1739-1750

Elsevier

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Electrochemical study of thiourea and substituted thiourea adsorbates on polycrystalline platinum electrodes in aqueous sulfuric acid

By Bolzán A.E.   Piatti R.C.V.   Salvarezza R.C.   Arvia A.J.  

Journal of Applied Electrochemistry, Vol. 32, Iss. 6, 2002-06 ,pp. : 611-620

Springer Publishing Company

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Formation and properties of UPD copper deposits on polycrystalline platinum electrodes

By Wunsche M.   Meyer H.   Schumacher R.  

Electrochimica Acta, Vol. 40, Iss. 5, 1995-04 ,pp. : 629-635

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Influence of phosphorous acid on the nucleation and growth of copper

By Urda M.   Oniciu L.   delplancke J-L.   Winand R.  

Journal of Applied Electrochemistry, Vol. 27, Iss. 5, 1997-05 ,pp. : 616-620

Springer Publishing Company

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