Study of anodic layers and their effects on electropolishing of bulk and electroplated films of copper

Author: Huo J.   Solanki R.   McAndrew J.  

Publisher: Springer Publishing Company

ISSN: 0021-891X

Source: Journal of Applied Electrochemistry, Vol.34, Iss.3, 2004-03, pp. : 305-314

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Abstract