Effects of K4Fe(CN)6 on electroless copper plating using hypophosphite as reducing agent

Author: Gan Xueping   Wu Yating   Liu Lei   Hu Wenbin  

Publisher: Springer Publishing Company

ISSN: 0021-891X

Source: Journal of Applied Electrochemistry, Vol.37, Iss.8, 2007-08, pp. : 899-904

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Abstract