Mathematical modeling of polish-rate decay in chemical-mechanical polishing

By Borucki L.  

Journal of Engineering Mathematics, Vol. 43, Iss. 2-4, 2002-08 ,pp. : 105-114

Springer Publishing Company

Access to resources Recommend Favorite

A theory of pad conditioning for chemical-mechanical polishing

By Borucki Leonard J.   Witelski Thomas   Please Colin   Kramer Peter R.   Schwendeman Donald  

Journal of Engineering Mathematics, Vol. 50, Iss. 1, 2004-09 ,pp. : 1-24

Springer Publishing Company

Access to resources Recommend Favorite

Stochastic Models for Pad Structure and Pad Conditioning Used in Chemical-Mechanical Polishing

By Wiegand Susanne   Stoyan Dietrich  

Journal of Engineering Mathematics, Vol. 54, Iss. 4, 2006-04 ,pp. : 333-343

Springer Publishing Company

Access to resources Recommend Favorite

An analytical solution for mechanical etching of glass by powder blasting

By ten Thije Boonkkamp J.H.M.   Jansen J.K.M.  

Journal of Engineering Mathematics, Vol. 43, Iss. 2-4, 2002-08 ,pp. : 385-399

Springer Publishing Company

Access to resources Recommend Favorite

Modeling and calculation of slurry-chemistry effects on chemical–mechanical planarization with a grooved pad

By Wang Yao-Chen   Yang Tian-Shiang  

Journal of Engineering Mathematics, Vol. 63, Iss. 1, 2009-01 ,pp. : 33-50

Springer Publishing Company

Access to resources Recommend Favorite