Recycling of epoxy resin compounds for moulding electronic components

Author: Iji M.  

Publisher: Springer Publishing Company

ISSN: 0022-2461

Source: Journal of Materials Science, Vol.33, Iss.1, 1998-01, pp. : 45-53

Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.

Previous Menu Next

Abstract