Relationship between deposition and recrystallization textures of copper and chromium electrodeposits

Author: Choi J.H.   Kang S.Y.   Lee D.N.  

Publisher: Springer Publishing Company

ISSN: 0022-2461

Source: Journal of Materials Science, Vol.35, Iss.16, 2000-08, pp. : 4055-4066

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Abstract