Microstructural evolution and growth velocity-undercooling relationships in the systems Cu, Cu-O and Cu-Sn at high undercooling

Author： Battersby S.E.   Cochrane R.F.   Mullis A.M.  

Publisher： Springer Publishing Company

ISSN： 0022-2461

Source： Journal of Materials Science, Vol.35, Iss.6, 2000-03, pp. : 1365-1373

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