Transient liquid phase bonding process using liquid phase sintered alloy as an interlayer material

Author:        

Publisher: Springer Publishing Company

ISSN: 0022-2461

Source: Journal of Materials Science, Vol.35, Iss.8, 2000-04, pp. : 1917-1924

Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.

Previous Menu Next

Abstract