Author: Kuo W-S. Ko T-H. Cheng K-B. Hsieh K-Y.
Publisher: Springer Publishing Company
ISSN: 0022-2461
Source: Journal of Materials Science, Vol.36, Iss.11, 2001-06, pp. : 2743-2752
Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.
Abstract