Failure paths at copper-base leadframe/epoxy molding compound interfaces

ISSN： 0022-2461

Source： Journal of Materials Science, Vol.37, Iss.19, 2002-10, pp. : 4247-4257

Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.

Previous Menu Next

Abstract

Related content

Effect of thermomechanical treatments on microstructure and properties of Cu-base leadframe alloy

By Ryu H.J. Baik H.K. Hong S.H.

Journal of Materials Science, Vol. 35, Iss. 14, 2000-07 ,pp. : 3641-3646

Springer Publishing Company

Access to resources Recommend Favorite

Analysis of structural defect annealing in copper-base alloys exhibiting the shape memory effect

By Kostrubiec B. Rasek J. Salamon A. Morawiec H.

Journal of Materials Science, Vol. 37, Iss. 2, 2002-01 ,pp. : 369-373

Springer Publishing Company

Access to resources Recommend Favorite

The contributions of morphological and surface chemical modifications to the elevated-temperature ageing of copper–epoxy interfaces

By LOVE B. J PACKMAN P. F

Journal of Materials Science, Vol. 33, Iss. 5, 1998-03 ,pp. : 1359-1367

Springer Publishing Company

Access to resources Recommend Favorite

Mold flow of sheet molding compound

By Okuno Toshifumi Fukuda Yoshihiro Nishino Kenichi

Advanced Composite Materials, Vol. 3, Iss. 2, 1993-01 ,pp. : 133-141

Taylor & Francis Ltd

Access to resources Recommend Favorite

Moisture-assisted crack growth at epoxy–glass interfaces

By RITTER J. E. FOX J. R. HUTKO D. I. LARDNER T. J.

Journal of Materials Science, Vol. 33, Iss. 18, 1998-09 ,pp. : 4581-4588

Springer Publishing Company

Access to resources Recommend Favorite