Author: Hamilton T. Gopal M. Atchley E. Smith Jr. J.E.
Publisher: Springer Publishing Company
ISSN: 0022-2461
Source: Journal of Materials Science, Vol.38, Iss.15, 2003-08, pp. : 3331-3335
Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.
Abstract
Related content
Experimental Investigation on Physical and Mechanical Behavior of Kathmandu Clay
Advanced Materials Research, Vol. 2018, Iss. 1145, 2018-05 ,pp. :