Author： Kim Jangsoon Cho Jaedong Lim Yun-Soo
Publisher： Springer Publishing Company
ISSN： 0022-2461
Source： Journal of Materials Science, Vol.40, Iss.11, 2005-06, pp. : 2789-2794
Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.
Abstract
Related content
Access to resources
Recommend
Evaluation on Interface Bonding of Thin Aluminum Clad Steel Strip
Advanced Materials Research, Vol. 2015, Iss. 1120, 2015-08 ,pp. :
Behavior and bonding mechanisms of aluminum nanoparticles by electron beam irradiation
Nanostructured Materials, Vol. 12, Iss. 5, 1999-01 ,pp. :