Anisotropic and negative thermal expansion behavior in a cellular microstructure

Author: Lim Teik-Cheng  

Publisher: Springer Publishing Company

ISSN: 0022-2461

Source: Journal of Materials Science, Vol.40, Iss.12, 2005-06, pp. : 3275-3277

Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.

Previous Menu Next

Abstract