Kinetics of interface reaction and intermetallics growth of Sn-3.5Ag-0.7Cu/Au/Ni/Cu system under isothermal aging

By Shi X. Q.   Kwan H. F.   Nai S. M. L.   Lim G. H.  

Journal of Materials Science, Vol. 39, Iss. 3, 2004-02 ,pp. : 1095-1099

Springer Publishing Company

Access to resources Recommend Favorite

Formation and growth of Ni3Sn4 intermediate phase in the Ni - Sn system

By Gur D.   Bamberger M.  

Journal of Materials Science, Vol. 35, Iss. 18, 2000-09 ,pp. : 4601-4606

Springer Publishing Company

Access to resources Recommend Favorite

Morphological aspects of competitive grain growth during directional solidification of a nickel-base superalloy, CMSX4

By D'Souza N.   Ardakani M.G.   Wagner A.   Shollock B.A.   McLean M.  

Journal of Materials Science, Vol. 37, Iss. 3, 2002-02 ,pp. : 481-487

Springer Publishing Company

Access to resources Recommend Favorite

Growth of large single-grain decagonal quasicrystal by directional solidification of undercooled Al₇₂Ni₁₂Co₁₆ alloy melt

By Liu Xinbao   Li Jianguo   Yang Gencang  

Journal of Materials Science, Vol. 40, Iss. 19, 2005-10 ,pp. : 5255-5258

Springer Publishing Company

Access to resources Recommend Favorite

Correlation of intermetallic compound growth behavior and melt state of Sn-3.5Ag-3.5Bi/Cu joint during soldering and isothermal aging

By Li Xiaoyun  

Journal of Materials Science: Materials in Electronics, Vol. 24, Iss. 4, 2013-04 ,pp. : 1231-1237

Springer Publishing Company

Access to resources Recommend Favorite