Bonding at copper–alumina interfaces established by different surface treatments: a critical review

Author: Scheu C.   Gao M.   Oh S.   Dehm G.   Klein S.   Tomsia A.   Rühle M.  

Publisher: Springer Publishing Company

ISSN: 0022-2461

Source: Journal of Materials Science, Vol.41, Iss.16, 2006-08, pp. : 5161-5168

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Abstract