Effect of the thickness of Bi–Te compound and Cu electrode on the resultant Seebeck coefficient in touching Cu/Bi–Te/Cu composites

Author: Yamashita Osamu   Odahara Hirotaka  

Publisher: Springer Publishing Company

ISSN: 0022-2461

Source: Journal of Materials Science, Vol.42, Iss.13, 2007-07, pp. : 5057-5067

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Abstract