

Author: Sarsfield Helen Wang Li Petrinic Nikica
Publisher: Springer Publishing Company
ISSN: 0022-2461
Source: Journal of Materials Science, Vol.42, Iss.13, 2007-07, pp. : 5085-5093
Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.
Abstract
Related content


Rate-dependent indentation behavior of solder alloys
By Wang Feng-Jiang Ma Xin Qian Yi-Yu
Journal of Materials Science, Vol. 40, Iss. 8, 2005-04 ,pp. :





