Impact of the electrodeposition chemistry used for TSV filling on the microstructural and thermo-mechanical response of Cu

Author： Okoro Chukwudi Labie Riet Vanstreels Kris Franquet Alexis Gonzalez Mario Vandevelde Bart Beyne Eric Vandepitte Dirk Verlinden Bert

Publisher： Springer Publishing Company

ISSN： 0022-2461

Source： Journal of Materials Science, Vol.46, Iss.11, 2011-06, pp. : 3868-3882

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