Channel cracking during thermal cycling of thin film multi-layers

Author: Begley M.R.   Ambrico J.M.  

Publisher: Springer Publishing Company

ISSN: 0376-9429

Source: International Journal of Fracture, Vol.119, Iss.4, 2003-01, pp. : 325-338

Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.

Previous Menu Next

Abstract