Mechanical properties and fracture toughness of organo-silicate glass (OSG) low-k dielectric thin films for microelectronic applications

Author: Vella J.B.   Adhihetty I.S.   Junker K.   Volinsky A.A.  

Publisher: Springer Publishing Company

ISSN: 0376-9429

Source: International Journal of Fracture, Vol.119, Iss.4, 2003-01, pp. : 487-499

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Abstract