Mechanical properties and fracture toughness of organo-silicate glass (OSG) low-k dielectric thin films for microelectronic applications

Author： Vella J.B. Adhihetty I.S. Junker K. Volinsky A.A.

Publisher： Springer Publishing Company

ISSN： 0376-9429

Source： International Journal of Fracture, Vol.119, Iss.4, 2003-01, pp. : 487-499

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