Failure Analysis of Adhesively Bonded Structures: From Coupon Level Data to Structural Level Predictions and Verification

Author： Chung Jaeung Waas Anthony Shahwan Khaled Schroeder Jessica Boeman Raymond Kunc Vlastimil Klett Lynn

Publisher： Springer Publishing Company

ISSN： 0376-9429

Source： International Journal of Fracture, Vol.134, Iss.3-4, 2005-08, pp. : 231-250

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