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Journal of Materials Science: Materials in Electronics, Vol. 16, Iss. 8, 2005-08 ,pp. : 523-528

Springer Publishing Company

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Effects of zinc on the interfacial reactions of tin–indium solder joints with copper

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Characterizing the formation and growth of intermetallic compound in the solder joint

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Effect of isothermal aging on intermetallic compound layer growth at the interface between Sn-3.5Ag-0.75Cu solder and Cu substrate

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Analytical treatment of diffusional growth kinetics of two intermetallic-compound layers

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