Structural, mechanical, hardness indentation measurements of Sn65−x Ag25Sb10Cux solder alloys rapidly solidified from melt at cooling rate 1.1×105 K s−1

Author： Shalaby R. M.  

Publisher： Springer Publishing Company

ISSN： 0957-4522

Source： Journal of Materials Science: Materials in Electronics, Vol.15, Iss.4, 2004-04, pp. : 205-209

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