Author: Seo Yong-Jin Kim Sang-Yong
Publisher: Springer Publishing Company
ISSN: 0957-4522
Source: Journal of Materials Science: Materials in Electronics, Vol.15, Iss.6, 2004-06, pp. : 363-367
Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.
Abstract
Related content
A simple condition monitoring model for a direct monitoring process
European Journal of Operational Research, Vol. 82, Iss. 2, 1995-04 ,pp. :
Effect of surface treatment on wafer direct bonding process
By Lai S.-I. Lin H.-Y. Hu C.-T.
Materials Chemistry and Physics, Vol. 83, Iss. 2, 2004-02 ,pp. :
The Process and Characteristics of Urban Spatial Structure Research in China
Advanced Materials Research, Vol. 2014, Iss. 1073, 2015-01 ,pp. :