Publisher: Springer Publishing Company
ISSN: 0957-4522
Source: Journal of Materials Science: Materials in Electronics, Vol.17, Iss.1, 2006-01, pp. : 63-70
Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.
Abstract
Related content
Microstructural study of co-electroplated Au/Sn alloys
Journal of Materials Science, Vol. 36, Iss. 3, 2001-02 ,pp. :