A new binderless thick-film piezoelectric paste

Author: Cotton Darryl   Chappell Paul   Cranny Andy   White Neil  

Publisher: Springer Publishing Company

ISSN: 0957-4522

Source: Journal of Materials Science: Materials in Electronics, Vol.18, Iss.10, 2007-10, pp. : 1037-1044

Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.

Previous Menu Next

Abstract