![](/images/ico/ico_close.png)
![](/images/ico/ico5.png)
Author: A. Ismail Raid Rasheed Bassam Salm Evan Al-Hadethy Mukram
Publisher: Springer Publishing Company
ISSN: 0957-4522
Source: Journal of Materials Science: Materials in Electronics, Vol.18, Iss.4, 2007-04, pp. : 397-400
Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.
Abstract
Related content
![](/images/ico/ico_close.png)
![](/images/ico/ico5.png)
![](/images/ico/ico_close.png)
![](/images/ico/ico5.png)
By Cao H. T. Sun C. Pei Z. L. Wang A. Y. Wen L. S. Hong R. J. Jiang X.
Journal of Materials Science: Materials in Electronics, Vol. 15, Iss. 3, 2004-03 ,pp. :
![](/images/ico/ico_close.png)
![](/images/ico/ico5.png)
![](/images/ico/ico_close.png)
![](/images/ico/ico5.png)
Copper nitride films produced by reactive pulsed laser deposition
By Soto G. Diaz J.A. de la Cruz W.
Materials Letters, Vol. 57, Iss. 26, 2003-09 ,pp. :
![](/images/ico/ico_close.png)
![](/images/ico/ico5.png)
By Prijamboedi B. Kashiwaya S.
Journal of Materials Science: Materials in Electronics, Vol. 17, Iss. 7, 2006-07 ,pp. :