Author: Simoen E. Claeys C. Sioncke S. Steenbergen J. Meuris M. Forment S. Vanhellemont J. Clauws P. Theuwis A.
Publisher: Springer Publishing Company
ISSN: 0957-4522
Source: Journal of Materials Science: Materials in Electronics, Vol.18, Iss.7, 2007-07, pp. : 799-804
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Abstract
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