Thermal behavior of copper powder prepared by hydrothermal treatment

Author: Hu Wencheng   Zhu Lin   Dong Dong   He Wei   Tang Xianzhong   Liu Xiaobo  

Publisher: Springer Publishing Company

ISSN: 0957-4522

Source: Journal of Materials Science: Materials in Electronics, Vol.18, Iss.8, 2007-08, pp. : 817-821

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