Effect of geometry and dielectric material on thermo-mechanical strain on micro-vias in build-up substrates

Author: Yamanaka Kimihiro   Fujisaki Teruya   Ichinose Manabu   Ooyoshi Takafumi  

Publisher: Springer Publishing Company

ISSN: 0957-4522

Source: Journal of Materials Science: Materials in Electronics, Vol.21, Iss.9, 2010-09, pp. : 943-949

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