Microstructure and hardness of copper powder consolidated by plasma pressure compaction

Author: Srivatsan T.   Ravi B.   Naruka A.   Riester L.   Yoo S.   Sudarshan T.  

Publisher: Springer Publishing Company

ISSN: 1059-9495

Source: Journal of Materials Engineering and Performance, Vol.10, Iss.4, 2001-08, pp. : 449-455

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