Electrodeposition of Platinum Metal and Platinum-Rhodium Alloy on Titanium Substrates

Author: Baraka A.   Shaarawy H.H.   Hamed H.A.  

Publisher: Springer Publishing Company

ISSN: 1059-9495

Source: Journal of Materials Engineering and Performance, Vol.12, Iss.1, 2003-02, pp. : 5-13

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Abstract

A method for application of an adherent platinum (Pt) and platinum-rhodium (Pt-Rh) alloy plate to a titanium (Ti) substrate includes steps of surface pretreatment, anodization, and electrodeposition of Pt and Pt-Rh alloy from their electrolytic baths consisting of H 2Pt2Cl6 · 6H2O (20 gL-1), and HCl (300 gL-1) for a Pt bath. The Pt-Rh bath consists of H2Pt2Cl6 · 6H2O (20 gL-1), and HCl (300 gL-1) and Rh2 (SO4)3 (2 gL­1). At the optimum conditions of electroplating, the Pt and Pt-Rh deposits were formed over the anodized Ti substrates with high adhesion, brightness, and high current efficiency (35.33% for Pt and 70.38% for the Pt-Rh alloy).