Laser shock processing induced residual compression: Impact on predicted crack growth threshold performance

Author: Shepard M.  

Publisher: Springer Publishing Company

ISSN: 1059-9495

Source: Journal of Materials Engineering and Performance, Vol.14, Iss.4, 2005-08, pp. : 495-502

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Abstract

Design credit is not currently taken for laser shock processing (LSP) induced compressive residual stresses in damage tolerant design. The inclusion of these and other compressive stresses in design practice has the potential to dramatically increase predicted fatigue crack growth threshold performance and damage tolerant design life. In the current effort, Ti-6Al-4V coupons will be subjected to shot peening, glass bead peening, and high intensity laser shock processing. The in-depth residual stresses due to processing will be analyzed and then input into a linear elastic fracture mechanics analysis code to predict fatigue crack growth threshold performance. This analysis establishes both the utility and feasibility of incorporating LSP-induced compressive residual stresses into damage tolerant design practice.