Thermal Stability and Tensile Properties of Electrodeposited Cu-Bi Alloy

Author: Chen Xianhua   Mao Jianjun  

Publisher: Springer Publishing Company

ISSN: 1059-9495

Source: Journal of Materials Engineering and Performance, Vol.20, Iss.3, 2011-04, pp. : 481-486

Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.

Previous Menu Next

Abstract