Application of the extended solvation model for thermodynamic study of copper ion binding to Jack bean urease

Author: Rezaei Behbehani G.   Saboury A.   Poorakbar E.   Barzegar L.  

Publisher: Springer Publishing Company

ISSN: 1388-6150

Source: Journal of Thermal Analysis and Calorimetry, Vol.102, Iss.3, 2010-12, pp. : 1141-1146

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Abstract