Curing Kinetics and Thermal Property Characterization of Bisphenol-F Epoxy Resin and MeTHPA System

Author: Zhao H.   Gao J.   Li Y.   Shen S.  

Publisher: Springer Publishing Company

ISSN: 1388-6150

Source: Journal of Thermal Analysis and Calorimetry, Vol.74, Iss.1, 2003-10, pp. : 227-236

Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.

Previous Menu Next

Abstract