Copper/low-k interconnects for smaller and faster circuits

By Mavoori Hareesh  

JOM, Vol. 51, Iss. 9, 1999-09 ,pp. : 36-36

Springer Publishing Company

Access to resources Recommend Favorite

Effect of PEG molecular weight on bottom-up filling of copper electrodeposition for PCB interconnects

By Yin L.   Liu Z. H.   Yang Z. P.   Wang Z. L.   Shingubara S.  

Transactions of the Institute of Metal Finishing, Vol. 88, Iss. 3, 2010-05 ,pp. : 149-153

Maney Publishing

Access to resources Recommend Favorite

The magnetic field-assisted assembly of nanoscale semiconductor devices: A new technique

By Shet Sudhakar   Mehta Vishal   Fiory Anthony   Ravindra N.   Lepselter Martin  

JOM, Vol. 56, Iss. 10, 2004-10 ,pp. : 32-34

Springer Publishing Company

Access to resources Recommend Favorite

Strategies for improving the reliability of solder joints on power semiconductor devices

By Lu Guo-Quan   Liu Xingsheng   Wen Sihua   Calata Jesus Noel   Bai John G.  

Soldering & Surface Mount Technology, Vol. 16, Iss. 2, 2004-08 ,pp. : 27-40

Emerald Group Publishing Ltd

Access to resources Recommend Favorite

Application of Pelletron Accelerator to Study High Total Dose Radiation Effects on Semiconductor Devices

By  

Solid State Phenomena, Vol. 2015, Iss. 239, 2015-09 ,pp. : 37-39

Trans Tech Publications

Access to resources Recommend Favorite