Overview: Diffusion Soldering for Stable High-Temperature Thin-Film Bonds

Author： Studnitzky Thomas   Schmid-Fetzer Rainer  

Publisher： Springer Publishing Company

ISSN： 1543-1851

Source： JOM, Vol.54, Iss.12, 2002-12, pp. : 58-63

Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.

Previous Menu Next

Abstract

Related content

Thin-film shape-memory materials for high-temperature applications

By Grummon David  

JOM, Vol. 55, Iss. 12, 2003-12 ,pp. : 24-32

Springer Publishing Company

Access to resources Recommend Favorite

Room-temperature diffusion in Cu/Ag thin-film couples caused by anodic dissolution

By Jones Denny   Jankowski Alan   Davidson Gail  

Metallurgical and Materials Transactions A, Vol. 28, Iss. 3, 1997-03 ,pp. : 843-850

Springer Publishing Company

Access to resources Recommend Favorite

Room-temperature diffusion in Cu/Ag thin-film couples caused by anodic dissolution

By Jones Denny   Jankowski Alan   Davidson Gail  

Metallurgical and Materials Transactions A, Vol. 28, Iss. 13, 1997-03 ,pp. : 843-850

Springer Publishing Company

Access to resources Recommend Favorite

Effect of Diffusion-Temperature on Microstructure and Mechanical Properties of Diffusion-Bonded TC4/Al Thin Film/1060 Al Joints

By  

Key Engineering Materials, Vol. 2017, Iss. 727, 2017-03 ,pp. : 972-976

Trans Tech Publications

Access to resources Recommend Favorite

High-temperature diffusion of oxygen in synthetic diopside measured by nuclear reaction analysis

By Pacaud L.   Ingrin J.   Jaoul O.  

Mineralogical Magazine, Vol. 63, Iss. 5, 1999-10 ,pp. : 673-673

Mineralogical Society

Access to resources Recommend Favorite