Electrochemical interfacial phenomena under microgravity: Part 2. Numerical analysis of the rate of ionic mass transfer accompanying anodic copper dissolution

By Konishi Y.   Fukunaka Y.   Kuribayashi K.  

Metallurgical and Materials Transactions B, Vol. 30, Iss. 4, 1999-08 ,pp. : 779-790

Springer Publishing Company

Access to resources Recommend Favorite

Electrochemical Phenomena in MnO₂-Fes₂ Leaching in Dilute HCl. Part 3: Manganese Dissolution from Indian Ocean Nodules

By Paramguru R. K.   Kanungo S. B.  

Canadian Metallurgical Quarterly, Vol. 37, Iss. 5, 1998-12 ,pp. : 405-417

Maney Publishing

Access to resources Recommend Favorite

Effect of Sulfide Ions on the Anodic Dissolution of Copper in Acetate Media

By Makarov A. G.   Batrakov V. V.   Makarov G. V.   Gorichev I. G.  

Protection of Metals, Vol. 40, Iss. 1, 2004-01 ,pp. : 49-55

MAIK Nauka/Interperiodica

Access to resources Recommend Favorite

Interfacial phenomena in the liquid copper-calcium ferrite slag system

By Sakai T.   Ip S.   Toguri J.  

Metallurgical and Materials Transactions B, Vol. 28, Iss. 3, 1997-06 ,pp. : 401-407

Springer Publishing Company

Access to resources Recommend Favorite

Research Summary: Electrochemical Machining: The Role of Steel Microstructure in High-Rate Anodic Dissolution

By Haisch T.   Mittemeijer E. J.  

JOM, Vol. 54, Iss. 7, 2002-07 ,pp. : 38-41

Springer Publishing Company

Access to resources Recommend Favorite