Development of a new CuNiTiB brazing alloy for joining Si₃N₄ to Si₃N₄

Author： Xiong Huaping Wan Chuangeng Zhou Zhenfeng

ISSN： 1543-1940

Source： Metallurgical and Materials Transactions A, Vol.29, Iss.10, 1998-10, pp. : 2591-2596

Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.

Previous Menu Next

Abstract

Related content

Self-joining of Si₃N₄ using metal interlayers

By Lemus-Ruiz José León-Patiño Carlos Drew Robin

Metallurgical and Materials Transactions A, Vol. 37, Iss. 1, 2006-01 ,pp. : 69-75

Springer Publishing Company

Access to resources Recommend Favorite

Joining of C f /SiC Composite and TC4 Using Ag-Al-Ti Active Brazing Alloy

By Xiong Jin

Journal of Materials Engineering and Performance, Vol. 20, Iss. 6, 2011-08 ,pp. : 1084-1089

Springer Publishing Company

Access to resources Recommend Favorite

Wettability and Shear Strength of Sn-Cu-Ni-xSi₃N₄ Composite Solder

Key Engineering Materials, Vol. 2016, Iss. 700, 2016-08 ,pp. : 152-160

Trans Tech Publications

Access to resources Recommend Favorite

High-temperature (to 1670°C) air oxidation of AlN–Si₃N₄ and AlN–Si₃N₄–(Ni–Cr–Al) ceramic materials

By Lavrenko V. Panasyuk A. Neshpor I.

Powder Metallurgy and Metal Ceramics, Vol. 49, Iss. 3-4, 2010-07 ,pp. : 238-244

Springer Publishing Company

Access to resources Recommend Favorite

Diffusion bonding of Si₃N₄-TiN composite with nickel-based interlayers

By Deschaux-Beaume F. Frety N. Colin C.

Metallurgical and Materials Transactions A, Vol. 34, Iss. 8, 2003-08 ,pp. : 1627-1636

Springer Publishing Company

Access to resources Recommend Favorite