Copper alloy-impregnated carbon-carbon hybrid composites for electronic packaging applications

Author： Datta S.   Tewari S.   Gatica J.   Shih W.   Bentsen L.  

Publisher： Springer Publishing Company

ISSN： 1543-1940

Source： Metallurgical and Materials Transactions A, Vol.30, Iss.1, 1999-01, pp. : 175-181

Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.

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