

Author: Liu Guanglei Duggan B.J.
Publisher: Springer Publishing Company
ISSN: 1543-1940
Source: Metallurgical and Materials Transactions A, Vol.32, Iss.1, 2001-01, pp. : 125-134
Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.
Abstract
Related content




By Toroghinejad Mohammad Ashrafizadeh Fakhraddin Najafizadeh Abbas Humphreys Alan Liu Dongsheng Jonas John
Metallurgical and Materials Transactions A, Vol. 34, Iss. 5, 2003-05 ,pp. :






Rolling textures in nanoscale Cu/Nb multilayers
By Anderson P.M. Bingert J.F. Misra A. Hirth J.P.
Acta Materialia, Vol. 51, Iss. 20, 2003-12 ,pp. :