Creep Deformation Characteristics of Tin and Tin-Based Electronic Solder Alloys

Author: Mathew M.D.   Yang H.   Movva S.   Murty K.L.  

Publisher: Springer Publishing Company

ISSN: 1543-1940

Source: Metallurgical and Materials Transactions A, Vol.36, Iss.1, 2005-01, pp. : 99-105

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Abstract