Author： Schaefer Robert J. Lewis Daniel J.
Publisher： Springer Publishing Company
ISSN： 1543-1940
Source： Metallurgical and Materials Transactions A, Vol.36, Iss.10, 2005-10, pp. : 2775-2783
Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.
Abstract
An experimental study of microstructures in a directionally solidified, near-eutectic Ag-Cu-Sn alloy has been completed. This material is an important candidate for use as a lead-free solder, and the studies show the origin and velocity dependence of some of the microstructures seen in solder joints. Quantitative stereology and microstructural observation were completed for directional solidification experiments where the sample was moved through a gradient furnace at velocities between 0.826 and 500
Related content
Access to resources
Recommend
Accurately determining eutectic compositions: The Sn-Ag-Cu ternary eutectic
JOM, Vol. 56, Iss. 4, 2004-04 ,pp. :