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Metallurgical and Materials Transactions A, Vol. 36, Iss. 6, 2005-06 ,pp. : 1557-1565

Springer Publishing Company

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The Effects of Composition and Microstructure on the Thermal Conductivity of Liquid-Phase-Sintered W-Cu

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Erratum to: The Effects of Composition and Microstructure on the Thermal Conductivity of Liquid-Phase-Sintered W-Cu

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Effect of Tungsten Particle Size and Copper Content on Working Behaviour of W–Cu Alloy Electrodes During Electrodischarge Machining

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The effect of tungsten particle size on the processing and properties of infiltrated W-Cu compacts

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