Correlation between Special Grain Boundaries and Electromigration Behavior of Aluminum Thin Films

Author： Lee K. T.   Szpunar J. A.   Morawiec A.   Knorr D. B.   Rodbell K. P.  

Publisher： Maney Publishing

ISSN： 0008-4433

Source： Canadian Metallurgical Quarterly, Vol.34, Iss.3, 1995-07, pp. : 287-292

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