An adaptive diagnosis system for copper wire bonding process control and quality assessment in integrated circuit assembly

Author: Tsai Tsung-Nan  

Publisher: Taylor & Francis Ltd

ISSN: 1362-3052

Source: International Journal of Computer Integrated Manufacturing, Vol.26, Iss.6, 2013-06, pp. : 513-526

Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.

Previous Menu Next

Abstract